-
AXIC, Inc manufactures and distributes semiconductor plasma processing equipment and Thin Film Metrology tools (Ellipsometer, Spectroscopic and Discrete ...
Diode etcher  ICP etch  ICP etcher  ICP PECVD  Photoresist stripper  Plasma wafer backside thinning  Rapid thermal processor 
www.axic.com - 2009-02-07
-
TriFact Solutions offers innovative products to provide high purity inline or recirculation heating of dilute chemicals as well as a new technology for dry ...
DI Heater  Dilute Chemical Heater  Dry Organic Removal  High Purity Heater  Ozone Stripping  Polymer Stripping  Recirculation Heater  Sidewall Polymer. 
www.trifact.net - 2009-02-13
-
Home page for Group T, manufacturer's representative and distributors for Honda Electronics, IN USA, Wafab International, VserV Technologies and FM Solar
Frank Gavin  organostrip  ozone strip  silicon brokers  Silicon Valley sales reps  VserV Technolgies  Wafab InternationalFM Solar  wet hoods 
www.grouptusa.com - 2009-02-04
-
Semitool ist ein weltweit führendes Unternehmen in den Bereichen Design, Entwicklung, Herstellung und Wartung von leistungsstarken und hochpräzisen Anlagen für ch ...
Al Etch  Au-plating Gold plating  Cu-plating  Electrochemical Deposition ECD  Fluorozone  Single wafer tool  Spin Rinse Dryer SRD  Spray Acid Tool SAT  Spray Solvent Tool SST  Wet chemical cleaning 
www.semitool.at - 2009-02-08
-
megasonics, defectivity, productivity, prime wafer, Goldfinger, SCP AWP single wafer single-wafer post etch Verteq automated wet bench automated wet station wet ...
defectivity  mono-crystalline  psg cleaning  removal equipment  saw damage removal 
www.akrionsystems.com - 2009-02-10
-
Oxford Plasma Technology homepage: Plasma Etching (RIE, PE), Plasma Deposition (PECVD, remote PECVD), Sputtering, Ion Beam Etching (IBE, RIBE, CAIBE), Ion Beam ...
remote plasma 
www.oxfordplasma.de - 2009-04-10
-
metal depositon on Silicon Wafers 25um to 10mm thick all types and dopants silicon single and double side polsihed and more including, GaAs, Ge, InP, SOI, GaN, ...
Alloying and Annealing  Die Attach and Bonding  Electron-Beam Evaporation  Filament Evaporation  Hard Bake  Induction Evaporation  Junction Formation  lga films  Packaging and Encapsulation  Photoresist Application  Silyation  Single Crystal Ingot Growth  Soft Bake  Wafer Sort and Test 
www.metaldeposition.com - 2009-02-09
|
|
|